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M555™

High Temperature Spyrometer® Camera

Dual wavelength, Infrared (IR) non-contact Pyrometer and Imaging System.

Tag Features

  • Rotary Kilns - Monitor cement and lime kiln product and temperatures. See potential kiln upsets early. Interface temperatures to your DCS.
  • Cement Clinker Coolers - Monitor the cooler for red rivers and upset conditions. Optimize cooling patterns by measuring clinker temperature on the grate. Aids in reducing equipment breakdown and refractory degradation. Obtain continuous visual of clinker depth and relation to grate speed changes.
  • Fossil Utility Boilers - Observe flame shape and temperature of each burner. Assign a temperature cursor to each flame to aid in controlling NOx levels.
  • Steel Reheat Furnaces - See areas of non-uniform heating and adjust product speed or combustion accordingly. Position temperature cursors to accommodate size and shape of the load.
  • Glass - View for flame impingement and product flow. Accurately measure refractory temperatures.
  • Copper Casting Wheels - Optimize metal flow to the casting mold while monitoring from the control room. Measure temperature of metal in casting spoons.

Description

The IST-Quadtek® Spyrometer 4, with its patented combination of a dual wavelength, Infrared (IR), non-contact pyrometer and imaging system gives the operator the ability to see process conditions while measuring the temperature of virtually any area in the field of view. The M555 imaging pyrometer takes the video image and the temperature information, multiplexes it and sends it, via coaxial cable, to the M215 S™ imaging processor in the control room and displays it on a VGA monitor.

The M215 S imaging processor provides on-screen temperature measurement facilities; the data can easily be interfaced to your control system using an Ethernet link or 4-20 mA outputs. Please refer to separate M215 S data sheet for full details.

Additional features of the M555 camera include:

  • Improved iris control options for a clearer image under changing lighting conditions
  • Less requirement for air cooling, reducing electrical power consumption in some applications
  • Fewer component parts
  • Improved reliability through use of surface mount

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